English

智能物联

智能视频

智能穿戴

CPU技术

可穿戴平台

物联网平台

  • Halley2
  • Halley
  • 其他平台


    • 专业级成像ISP和H.264编码(960P)

    • 高性能处理器支持智能分析(>1G CPU,128Bits SIMD引擎)

    • 业内最低功耗(典型功耗390mW 含DDRII)


    芯片框图


    T10高清



      芯片规格

    CPU

    XBurst single core, up to 1GHz.
    MXU2.0 IVS Engine, innovative 128 bit SMID extension instruction
    32KB L1 I-cache and 32KB L1 D-cache.
    128KB L2 unified cache. 
    Hardware floating point unit.

    Encoder engine

    H.264 baseline, main profile

    MJPEG/JPEG Baseline

    Encode Performance

    Max resolution 1280x960

    Up to H.264 960P@40fps encode

    H.264 multiple streams

    --720P@30fps+VGA@30fps+JPEG@15fps

    --960P@30fps+VGA@30fps+JPEG@15fps

    ABR/VBR/CBR/CQP

    8 ROIs

    5-layer OSD with hardware

    ISP

    AE, AWB, AF

    Lens shading correction

    Advanced spatial noise reduction

    Motion-adaptive temporal noise reduction (3D de-noise)

    Multi-exposure HDR image fusion (WDR)

    Space-variant HDR processing

    Host tuning tools

    Memory

    Embedded DDRII@400Mhz

    Maximum capacity of 512Mbit

    Computer Vision

    Motion Detection/Perimeter Protection

    Face Detection

    Human Detection

    People Counting

    License Plate Recognition

    CMOS Sensor

    Maximum 12 bit HSYNC/VSYNC (DVP)

    I2C sensor control, Flash and DC control

    Programmable sensor clock output

    Up to 100M pixels/s input

    Audio

    Embedded audio CODEC.

    AAC, G726, G711, PCM encoding

    Echo cancellation

    On-chip Peripherals

    POR, RTC, WDT

    2 channel ADC

    UART x 2, I2C x 2, SPI x 2, GPIO x 12

    SDIO x 2, support SDHC

    PWM x 4

    USB OTG

    RMII EMAC, support PHY clock output.

    Security

    AES/DES/3DES by Hardware

    Global unique Chip ID

    32Byte customer OTP

    Physical Feature

    Less than 400mW power consumption including DDRII

    TFBGA181 ROHS, ball pitch of 0.65mm,body size of 10mmx10mm

    OS

    Linux-3.10.




      资料下载


    File

    Description

    T10_PB.PDF

    T10 芯片简介


    市场电话:(86-10)56345028
    投资服务:(86-10)56345005
    业务咨询:marketing@ingenic.com
    技术支持:support@ingenic.com

    2014 版权所有 北京君正集成电路股份有限公司 京ICP备14059840号