English

智能物联

智能视频

智能穿戴

应用处理器

CPU技术

可穿戴平台

物联网平台

  • Halley2
  • Halley
  • 其他平台

     

    • 移动设备级的性能 XBurst CPU单核1.0GHz

    • 可穿戴设备级的超低功耗 (0.07mW/MHz)

    • 适合可穿戴设备的封装 (11 x 11 x 1.4 mm)

    • 内置128MB LPDDR内存



     

     

    芯片框图




    芯片规格


    CPU

    XBurst core, 1.0GHz (MIPS-based). 32KB L1 cache, 256KB L2 cache.

    GPU

    X2D: Resizing, Rotating, Mirror, Color Convention and OSD etc.

    VPU

    Video encoder: H.264, D1@30fps.

    Video decoder: H.264, MPEG-1/2/4, VC-1, VP8, RV9, 720P@30fps.

    Memory

    On-chip 128MB LPDDR, up to 320Mbps.

    64-bit ECC NAND flash, 512B/2KB/4KB/8KB/16KB page size.

    Conventional and toggle NAND flash.

    Display

    LCD controller with OSD: TFT, SLCD, up to 1280*720@60Hz(BPP24).

    Embedded E-Ink controller with color engine.

    Camera

    DVP interface, up to 2048 x 2048.

    Audio

    Embedded audio CODEC.

    Digital DMIC controller.

    AC97/I2S/SPDIF interface for external audio codec.

    PCM interface, master and slave mode.

    ADC

    7 channels SAR A/D controller, 12-bit resolution.

    On-chip Peripherals

    USB 2.0 OTG.

    USB 1.1 Host.

    MMC/SD/SDIO controller.

    Full-duplex UART port.

    Synchronous serial interface.

    Two-wire SMB serial interface.

    Security

    Total 256bits OTP memory.

    Package

    BGA261, 11 x 11 x 1.4 (mm), 0.5mm pitch.

    OS

    Android 4.3 and beyond.


    `


    资料下载


    File

    Description

    M150_DS.PDF

    M150 Datasheet.

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