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智能物联

智能视频

智能穿戴

应用处理器

CPU技术

可穿戴平台

物联网平台

  • Halley2
  • Halley
  • 其他平台

     

    • 移动设备级的性能 XBurst CPU双核 (1.2GHz/300MHz)

    • 可穿戴式设备级的超低功耗 (0.07mW/MHz)

    • 内置语音唤醒引擎, 3D GPU, VPU, ISP

    • PoP封装 (12 x 12 mm)




    芯片框图




    芯片规格


    CPU

    XBurst-HP core, 1.2GHz (MIPS-based).

    XBurst-LP core, 300MHz (MIPS-based).

    32KB L1 I-cache and 32KB L1 D-cache for each core.

    512KB L2 unified cache.

    GPU

    3D GPU with OpenGL ES 2.0/1.1 compliant.

    2D GPU with OpenVG 1.1 compliant.

    VPU

    Video encoder: H.264, VP8, 720P@30fps.

    Video decoder: H.264, MPEG-4, MPEG-1/2, VC-1, RV9, VP8, 720P@30fps.

    ISP

    Wide Dynamic Range (EDR), dual-stream processing.

    Video and still image stabilization.

    Image cropping and rescaling.

    Auto exposure and gain control.

    Auto white balancing and auto focus control.

    Edge sharpening and advanced noise reduction.

    Color correction and management.

    Auto contrast enhancement and Gamma correction.

    Special digital effects.

    Memory

    DDR2, DDR3, LPDDR, LPDDR2, up to 667Mbps.

    16 and 32 bit external DDR data width.

    64-bit ECC NAND flash support, 512B/2KB/4KB/8KB/16KB page size.

    Toggle1.0 and ONFI2.0 NAND.

    2 channels high performance PDMA, and 30 channels general purpose DMA.

    Display

    LCD controller with OSD: TFT, SLCD and MIPI-DSI (2-lanes).

    Embedded E-Ink controller.

    Camera

    MIPI-CSI2 (2-lanes) and DVP interface.

    Audio

    Embedded audio CODEC.

    Low power DMIC controller.

    AC97/I2S/SPDIF interface for external audio codec.

    PCM interface, master and slave mode.

    Voice Trigger Engine

    System wakeup on specific voice command, programmable.

    ADC

    3 channels SAR A/D controller, 12-bit resolution.

    On-chip Peripherals

    USB 2.0 OTG.

    USB Host 2.0.

    MMC/SD/SDIO controller.

    Full-duplex UART port.

    Synchronous serial interface.

    Two-wire SMB serial interface.

    Security

    Total 4KB OTP memory.

    Highest lever 1 security boot.

    Package

    POP package, BGA 260/168-pin on bottom/top, 12 x 12 (mm), 0.65/0.4 mm pitch.

    OS

    Android 5.1 and beyond.




    资料下载


    File

    Description

    M200S_DS.PDF

    M200S Datasheet.

    XBurst_ISA_MXU_PM.pdf

    SIMD_MXU指令文档

    MXU-User-Guide.pdf

    SIMD_MXU用户使用文档



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